Electronic control system_M.D.Tech
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electric control system

The composition of automobile electronic control system is: sensor, control unit, actuator composition, the core component is the control unit.

Electric motor electronic control system as an important part of the new energy automobile industry chain, its technology, manufacturing level directly affects the performance and cost of the vehicle at present, the degree of autonomy in the field of electric control in the country is still far behind the battery by Komaida for many years committed to research and development of imported adhesive flat class products, enhance the market competitiveness of domestic enterprises.



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Model Application product Product type component type curing conditions Advantages
MDSI 6230(15#) Inductance potting Silicone Two-component room temperature curing or heating curing Two-component1:1
MDEP 3112(1#) Inductance potting epoxy Two-component room temperature curing or heating curing two-component medium low viscosity
MDSI 340 current sensor Silicone Two-component room temperature curing or heating curing heat conduction flame retardant
MDEP 3112(1#) current sensor epoxy Two-component room temperature curing or heating curing two-component medium low viscosity
MDEP 3115 EMC core potting epoxy Two-component room temperature curing or heating curing heat curing, high TG, high thermal conductivity
MDSI 6606 IGBT/SICmodule Silicone Two-component room temperature curing temperature resistance -50-220℃
MDGR 5530 IGBT/SICmodule Silicone Owo-component room temperature curing thermal conductivity 3.0W/mk
MDTC 50# power device heat conduction Silicone Owo-component room temperature curing thermal conductivity 5.0W/mk
MDTC 60# power device heat conduction Silicone Owo-component room temperature curing thermal conductivity 6.0W/mk
MDSI N7339 shell bonding seal Silicone Owo-component room temperature curing or heating curing FIGP
MDSI 6530 shell bonding seal Silicone Two-component room temperature curing or heating curing FIGP & CIPG
MDSI 7435 shell bonding seal Silicone Owo-component heating curing FIGP & CIPG
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