electric control system
The composition of automobile electronic control system is: sensor, control unit, actuator composition, the core component is the control unit.
Electric motor electronic control system as an important part of the new energy automobile industry chain, its technology, manufacturing level directly affects the performance and cost of the vehicle at present, the degree of autonomy in the field of electric control in the country is still far behind the battery by Komaida for many years committed to research and development of imported adhesive flat class products, enhance the market competitiveness of domestic enterprises.
Model | Application product | Product type | component type | curing conditions | Advantages |
MDSI 6230(15#) | Inductance potting | Silicone | Two-component | room temperature curing or heating curing | Two-component1:1 |
MDEP 3112(1#) | Inductance potting | epoxy | Two-component | room temperature curing or heating curing | two-component medium low viscosity |
MDSI 340 | current sensor | Silicone | Two-component | room temperature curing or heating curing | heat conduction flame retardant |
MDEP 3112(1#) | current sensor | epoxy | Two-component | room temperature curing or heating curing | two-component medium low viscosity |
MDEP 3115 | EMC core potting | epoxy | Two-component | room temperature curing or heating curing | heat curing, high TG, high thermal conductivity |
MDSI 6606 | IGBT/SICmodule | Silicone | Two-component | room temperature curing | temperature resistance -50-220℃ |
MDGR 5530 | IGBT/SICmodule | Silicone | Owo-component | room temperature curing | thermal conductivity 3.0W/mk |
MDTC 50# | power device heat conduction | Silicone | Owo-component | room temperature curing | thermal conductivity 5.0W/mk |
MDTC 60# | power device heat conduction | Silicone | Owo-component | room temperature curing | thermal conductivity 6.0W/mk |
MDSI N7339 | shell bonding seal | Silicone | Owo-component | room temperature curing or heating curing | FIGP |
MDSI 6530 | shell bonding seal | Silicone | Two-component | room temperature curing or heating curing | FIGP & CIPG |
MDSI 7435 | shell bonding seal | Silicone | Owo-component | heating curing | FIGP & CIPG |